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- Other than BricsCAD ACIS based CAD software includes: Abaqus, ADEM, Alibre, ANSYS, CADKey, Cimatron, Cobalt, Gambit, GstarCAD, IronCAD, KeyCreator, Naastran, Patran, SpaceClaim, TransMagic and ZWCAD. AutoCAD and Autodesk Inventor use the ShapeManager kernel which forked from ACIS version 7 in 2001. What does A.C.I.S.
- Parasolid is integrated by more than 130 software vendors, giving end-users 100 percent 3D model compatibility between 350+ applications based on the Parasolid XT data format. Parasolid is complemented by Data access and translation solutions that enable the import and export of 3D models in alternative formats.
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Nowadays most NC programs are created via computer aided manufacturing (CAM) tools. However, these kinds of software only consider the work piece and the tool. Yet, the increasing complexity of product and part 1 demands higher security regarding the process functionality 2 and virtual verification based on digital data, e.g. CAD data 3, 4. The 3D ACIS Modeler is a geometric modeling kernel developed by Spatial Corporation, part of Dassault Systemes. ACIS is used by many software developers in industries such as computer-aided design, computer-aided manufacturing, computer-aided engineering, architecture, engineering and construction, coordinate-measuring machine, 3D animation, and shipbuilding. ACIS provides software developers and manufacturers the underlying 3D modeling functionality.
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Design solutions for AR/VR, engineering simulations, on-demand manufacturing and more.Explore frequent use cases
3DS is one of the file format used by the Autodesk 3D modeling, animation and rendering software. It once was native for the old Autodesk 3D Studio DOS and eventually has grown to become a de facto industry standard for transferring models between 3D programs, or for storing models for 3D resource catalogs.
3DS is aimed at providing an import/export format, retaining only essential geometry, texture and lighting data.
ACIS geometric modeling kernel is used by many software developers in industries such as computer-aided design (CAD), computer-aided manufacturing (CAM), computer-aided engineering (CAE), architecture, engineering and construction (AEC), coordinate-measuring machine (CMM), 3D animation, and shipbuilding. ACIS has also been used as the foundation of the Shape Manager kernel used by Autodesk in its applications. So the ACIS format is a preferred file format when exchanging data with Autodesk apps.
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From 3DS to ACIS, CAD Exchanger gets you covered.
The 3D module extrudes the 2D outlines of components, substrates, cavities and holes and wires to create true 3D ACIS compatible solids.
The 3D Module automatically generates ACIS compatible solids including voids, holes and boundaries from a design done with EPD. It is automatically configured from thicknesses stored in the material stack-up section of the Technology system.
Creates 3D models of bond wires by combining a side view profile (unlimited numbers of profiles can be made) with the top view of the wires.
Automatic Setup from pre-configured stackup data set in the Hispeed command or an optional manual override with easy to use controls.
Uses custom bondwire profiles that can be differently assigned to each wire.
Many 3D viewing and rendering options built in.
ACIS compatible option so 3D files can be sent to popular modeling programs such as Solidworks and other ACIS compatible programs.
Stores and reads back stackup data files.
Makes voids where holes go through pads and vias.
Makes voids in cavities on either side of the substrate.
Automatically adds 3D solder balls to BGAs.
Allows manual control of elevation and thickness of each entity.
Extrudes traces, pads and components to make a 3D view of the layout.
Creates plating inside PCB holes.
Each component has an editable height that is a built in attribute.
Create 3D models for Lead Frame, IC Packaging, PCBs, RF and Ceramic MCM designs.
3D Bond Wires
The bondwire extrudes along the custom Bond Wire profiles to make any shape 3D bond wires. It extrudes holes and then subtracts them from the substrates, traces, pads, planes etc.
One of the most important features of any Electronic Design Automation (EDA) layout system is its 3D architecture. As designs trend toward increased speeds/densities, miniaturization of packages/modules, and integrated components with System-in-Package (SiP) technology, it is increasingly important to verify the package integrity using a modern, 3D-based system.
The 3D system can have a tremendous impact on the time spent in design and analysis, and thus on your company’s bottom line. In cooperation with the world’s leading companies, CAD Design Software provides award-winning layout solutions to address today’s most demanding technologies across all industries. All CAD Design Software layout systems feature 3D as a key part of the software design. Among the features are:
3D solid models – A true 3D solid modeling graphics engine, based on the ACIS kernel, guarantees 100% compatibility with all Mechanical CAD applications. 3D models can be generated automatically at any time, including realistic bondwire profiles. This provides the ideal PLM-style data storage solution to ensure that all members of your team can communicate and collaborate on engineering projects using a concurrent design system, not a sequential one.
Analysis Links – CDS systems feature intelligent links to the most popular analysis software (see full list here). These links are achieved through intelligent APIs, not through un-intelligent data formats. The use of these links can enable designers to work up to 200X faster, by reducing transfer/setup time between applications.
By incorporating 3D in your design process, you can significantly boost your team’s efficiency, and you can reduce design rework cycles and errors. More importantly, a modern layout system can be the gateway to innovation and development of better products and additional business in your organization. As your software technology partner, CDS is committed to making your goals a reality. What you now do in a week, you could be doing in a day. What you now do in a day, you could be doing in an hour.
3D Design for Lead Frame
Create entire lead frame including Downsets, Gull wings and custom bondwire profiles.
3D Design for IC Packaging
Create Solder balls using Radius and Flatness
Subtract Via holes from Substrate, Pads and Traces
Cad Software Based On Acis Kernel Security System
3D Design for PCB / RF and Ceramic MCM
Create through-hole vias that subtract from substrate
Support for creating multiple cavities and bondwire shelve assignment
Create and use 3D parts from library
3D MCM with 3 chips, multi-level cavity:
3D RF Layout with embedded coupler:
Complex Cavity Ceramic MCM with high-frequency Ribbon Bond Wires: